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9780071785143
Through-Silicon Vias for 3D Integration / Edition 1 available in Hardcover, eBook
![Through-Silicon Vias for 3D Integration / Edition 1](http://img.images-bn.com/static/redesign/srcs/images/grey-box.png?v11.11.4)
Through-Silicon Vias for 3D Integration / Edition 1
- ISBN-10:
- 0071785140
- ISBN-13:
- 9780071785143
- Pub. Date:
- 09/20/2012
- Publisher:
- McGraw Hill LLC
- ISBN-10:
- 0071785140
- ISBN-13:
- 9780071785143
- Pub. Date:
- 09/20/2012
- Publisher:
- McGraw Hill LLC
![Through-Silicon Vias for 3D Integration / Edition 1](http://img.images-bn.com/static/redesign/srcs/images/grey-box.png?v11.11.4)
Through-Silicon Vias for 3D Integration / Edition 1
$179.0
Current price is , Original price is $179.0. You
179.0
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Product Details
ISBN-13: | 9780071785143 |
---|---|
Publisher: | McGraw Hill LLC |
Publication date: | 09/20/2012 |
Pages: | 512 |
Product dimensions: | 6.20(w) x 9.10(h) x 0.80(d) |
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