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Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
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Boundary-Scan Interconnect…
by Josï T. de Sousa, Peter Y.K. Cheung
#18 in Series
Paperback $169.99
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
Paperback $54.95
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
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Contamination of Electronic…
by Elissa M. Bumiller, David A. Douthit, Joan Pecht
Explore Series
Paperback $82.99
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
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Package Electrical Modeling,…
by Dean L. Monthei
#2 in Series
Hardcover $109.99
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
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Hermeticity of Electronic…
by Hal Greenhouse
Hardcover $199.00
Title: Soldering Processes and Equipment / Edition 1, Author: Michael Pecht
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Soldering Processes and…
by Michael Pecht
Hardcover $177.95
Title: The Electronic Packaging Handbook / Edition 1, Author: Glenn R. Blackwell
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The Electronic Packaging…
by Glenn R. Blackwell
#4 in Series
Hardcover $300.00
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
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MCM C/Mixed Technologies and…
by W.K. Jones, Karel Kurzweil, Gábor Harsányi, Sylvia Mergui
#2 in Series
Hardcover $219.99
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
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Manufacturing Challenges in…
by Y.C. Lee, W.T. Chen
Hardcover $109.99
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
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High-Frequency…
by Luc Martens
#1 in Series
Hardcover $109.99
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Hardcover $169.99
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
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The Handbook of Machine…
by Ralph W. Woodgate
Explore Series
Hardcover $218.95
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
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Fundamentals and Essentials of…
by Puligandla Viswanadham
Explore Series
Hardcover $129.00
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
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Adhesives Technology for…
by James J. Licari, Dale W. Swanson
Explore Series
Paperback $199.00
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
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Electronic Packaging Materials…
by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
#4 in Series
Hardcover $200.00
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
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Failure Modes and Mechanisms…
by P. Singh, Puligandla Viswanadham
Hardcover $169.99
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1, Author: Yong Liu
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Power Electronic Packaging:…
by Yong Liu
Hardcover $279.99
Title: Advanced Wirebond Interconnection Technology / Edition 1, Author: Shankara K. Prasad
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Advanced Wirebond…
by Shankara K. Prasad
Other Format $329.99

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