Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition / Edition 3, Author: Ali Jamnia
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability / Edition 1, Author: Michael Pecht
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1, Author: Yong Liu
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: The Electronic Packaging Handbook / Edition 1, Author: Glenn R. Blackwell
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn

Pagination Links