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Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
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Adhesives Technology for…
by James J. Licari, Dale W. Swanson
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eBook $168.99 $225.00 Current price is $168.99, Original price is $225.00.
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Paperback $279.99
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
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Electronics Packaging Forum:…
by James E. Morris
Paperback $54.99
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
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Modeling and Design of…
by Xing-Chang Wei
eBook $44.99 $59.95 Current price is $44.99, Original price is $59.95.
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht
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Quality Conformance and…
by Michael Pecht, Abhijit Dasgupta, John W. Evans, Jillian Y. Evans
Paperback $188.95
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
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High Temperature Electronics /…
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
Paperback $82.99
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1, Author: Yong Liu
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Power Electronic Packaging:…
by Yong Liu
Hardcover $279.99
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
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Materials for Electronic…
by Deborah D.L. Chung
Hardcover $300.00
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
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Mechanical Analysis of…
by Mckeown
Paperback $82.99
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
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Chip On Board: Technology for…
by John H. Lau
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Hardcover $219.99
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
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Microscale Heat Transfer -…
by S. Kakaï, L.L. Vasiliev, Y. Bayazitoglu, Y. Yener
#193 in Series
Paperback $329.99
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
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Handbook Of Electronics…
by Bernard S. Matisoff
Paperback $54.99
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
eBook $46.49 $61.99 Current price is $46.49, Original price is $61.99.
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
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Failure Modes and Mechanisms…
by P. Singh, Puligandla Viswanadham
Hardcover $169.99
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
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Hermeticity of Electronic…
by Hal Greenhouse
Hardcover $199.00
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
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Hardcover $329.99
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
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Thermal Design of Electronic…
by Ralph Remsburg
#10 in Series
Hardcover $230.00
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael G. Pecht, Edward B. Hakim
Paperback $54.95
Title: The Electronic Packaging Handbook / Edition 1, Author: Glenn R. Blackwell
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The Electronic Packaging…
by Glenn R. Blackwell
#4 in Series
Hardcover $300.00
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
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Contamination of Electronic…
by Elissa M. Bumiller, David A. Douthit, Joan Pecht
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Paperback $82.99

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