Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
Title: Electronic Packaging for High Reliability, Low Cost Electronics, Author: R.R. Tummala
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
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Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
Title: Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact, Author: Katsuaki Suganuma
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Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
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Title: Thermal Stress and Strain in Microelectronics Packaging, Author: John Lau
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies / Edition 1, Author: Karl J. Puttlitz
Title: The Electronics Assembly Handbook, Author: Frank Riley

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