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Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
Title: Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications / Edition 2, Author: James J. Licari
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
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Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
Title: The Electronics Assembly Handbook, Author: Frank Riley
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
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Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu

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