Sensor Technology and Devices / Edition 1

by Ljubisa Ristic

Overview

"A results-oriented book. Quality line drawings, lucid photography, and informative graphs are used generously... The theoretical rigor of each chapter amply supports the real-world design examples that follow". -- Sensors Magazine

"One of the few sources to offer such comprehensive coverage". -- IEEE Electrical Insulation

Product Details

ISBN-13:	9780890065327
Publisher:	Artech House, Incorporated
Publication date:	03/01/1994
Pages:	540
Product dimensions:	6.00(w) x 9.00(h) x 1.38(d)

Table of Contents

	Preface	xiii
Chapter 1	Sensing the Real World
1.1	Introduction	1
1.2	Sensor Classification	2
1.3	Sensor Parameters	3
1.4	A Seamless Sensor System	4
1.5	Sensor Industry Growth	6
1.6	Summary	8
	References	11
Chapter 2	Modeling and Simulation of Microsensors and Actuators
2.1	Introduction	13
2.2	Modeling Equations	14
2.2.1	The Basic Semiconductor Equations	14
2.2.2	Boundary Conditions	16
2.2.3	Simplification of the Problem	17
2.2.4	Combination of Mechanical and Electrical Effects	18
2.3	Discretization Procedures	20
2.3.1	Accelerated Nonlinear Procedures	21
2.3.2	Methods of Solution and Grid Generation	22
2.3.3	Equation Discretization	26
2.3.4	Error Checking	29
2.4	Results and Discussion	30
2.4.1	Hall Devices	30
2.4.2	Magnetotransistor	33
2.4.3	Micromachined Flow Sensor	36
2.4.4	Dynamic Microstructures	39
2.5	Summary	43
	References	43
Chapter 3	Bulk Micromachining Technology
3.1	Introduction	49
3.2	Basic Concept of Bulk Micromachining	50
3.2.1	Silicon as a Mechanical Material	50
3.2.2	Wet Anisotropic Etching	51
3.2.3	Anisotropic Etchants	59
3.2.4	Etch-Stop Mechanisms	69
3.3	CMOS Technology and Bulk Micromachining	76
3.3.1	CMOS Processing	76
3.3.2	Micromechanical Structures in CMOS Processing	77
3.4	Applications of Bulk Micromachining	82
3.4.1	Bulk Micromachined Accelerometer	82
3.4.2	Thermal Infrared Sensor	84
3.4.3	Inductors in CMOS Technology	86
3.5	Summary	89
	References	90
Chapter 4	Surface Micromachining Technology
4.1	Introduction	95
4.2	Basic Concept of Surface Micromachining Technology	96
4.2.1	Layer Stacking	96
4.2.2	Sealing	98
4.3	Polysilicon for Surface Micromachining	99
4.3.1	Deposition of Polysilicon	100
4.3.2	As-Deposited Film Stress	105
4.3.3	Annealing of Undoped Films	107
4.3.4	In-Situ Doping	108
4.3.5	Ex-Situ Doping	115
4.3.6	Sacrificial Layers and Sacrificial Etching	118
4.3.7	Stiction	124
4.4	Mechanical Characterization of Polysilicon	126
4.4.1	Test Structures for In-Situ Characterization	126
4.4.2	Gradient of Residual Stress	130
4.4.3	Load-Response Characterization	133
4.5	Application of Surface Micromachining	140
4.5.1	Surface Micromachined Accelerometer	140
4.5.2	Electrostatically Driven Resonators	143
4.5.3	Integration of Surface Micromachined Structures--Processing Issues	144
4.6	LIGA Process	146
4.7	Summary	149
	References	150
Chapter 5	Silicon Direct Wafer Bonding
5.1	Introduction	157
5.2	Mechanism of Direct Wafer Bonding	159
5.2.1	SiO[subscript 2]//SiO[subscript 2] Bonding	160
5.2.2	Si//Si Bonding	164
5.3	Processing Considerations	168
5.3.1	Interface Integrity	168
5.3.2	Bond Strength	178
5.3.3	Shaping Bonded Wafers	180
5.3.4	Microdefects in Bonded Wafers	186
5.4	Application of Direct Wafer Bonding to Sensors and Actuators	192
5.4.1	Threshold Pressure Switch	192
5.4.2	Pressure Sensor	195
5.4.3	Peristaltic Membrane Pump	198
5.5	Summary	199
	References	199
Chapter 6	Packaging for Sensors
6.1	Introduction	203
6.2	Basic Considerations for Sensor Packaging	204
6.3	Wafer-Level Packaging	207
6.3.1	Glass-Sealed Technique	208
6.3.2	Anodic Bonding	210
6.4	Assembly Techniques	212
6.4.1	Die Bonding	212
6.4.2	Wire Bonding	217
6.4.3	Chip Coatings	219
6.4.4	Package Types	220
6.5	Packaging for Specific Applications	227
6.5.1	Pressure Sensor Packaging	227
6.5.2	Accelerometer Packaging	235
6.6	Summary	237
	References	237
Chapter 7	Magnetic Field Sensors Based on Lateral Magnetotransistors
7.1	Introduction	239
7.2	Lateral Magnetotransistors	240
7.2.1	Combined Action of an Electric Field and a Magnetic Field	241
7.2.2	Lateral Magnetotransistor in CMOS Technology	242
7.2.3	Suppressed Sidewall Injection Magnetotransistor in CMOS Technology	243
7.2.4	Suppressed Sidewall Injection Magnetotransistor in Bipolar Technology	255
7.2.5	Offset in Magnetotransistors	258
7.2.6	Noise in Magnetotransistors	260
7.2.7	Surface Effects	268
7.3	Multidimensional Sensing	270
7.3.1	Lateral Magnetotransistor Sensitive to Magnetic Field Either Parallel or Perpendicular to the Chip Surface	271
7.3.2	Two-Dimensional Sensing	273
7.3.3	Three-Dimensional Sensing	277
7.4	Summary	282
	References	282
Chapter 8	Thermal Sensors
8.1	Introduction	287
8.2	Bipolar Devices as Temperature Sensors	288
8.2.1	Diodes as Temperature Sensors	289
8.2.2	Bipolar Transistors as Temperature Sensors	290
8.2.3	Stability	294
8.3	Integrated Temperature Sensors in Bipolar Technology	294
8.4	Intrinsically Referenced Temperature Sensors	300
8.5	Temperature Sensors in CMOS Technology	302
8.5.1	Bipolar Transistors in CMOS Technology	302
8.5.2	Integrated Temperature Sensors in CMOS Technology Based on Bipolar Transistors	304
8.5.3	Temperature Sensors Based on MOS Transistors and Resistors	307
8.5.4	Temperature Sensors with Digital Output	309
8.6	Polysilicon Resistors	311
8.7	Summary	313
	References	313
Chapter 9	Planar Silicon Photosensors
9.1	Introduction	317
9.2	Planar Silicon Photodiodes	320
9.3	Fundamentals of Photosensors	322
9.3.1	Material Properties	322
9.3.2	Quantum Efficiency	326
9.3.3	Collection Efficiency Models	327
9.3.4	Photocurrent	330
9.3.5	Noise Current	331
9.3.6	Response Time	333
9.4	Level of Integration	334
9.5	Summary	337
	References	338
Chapter 10	Charge Coupled Devices
10.1	Introduction	341
10.2	Basic Concepts	342
10.2.1	CCD Charge Storage Fundamentals	342
10.2.2	CCD Architectures	343
10.2.3	Three-Phase CCD Example	344
10.3	Quantum Efficiency	347
10.3.1	QE Model	348
10.3.2	Quantum Yield and Photon Transfer Curve	348
10.3.3	Backside Illumination and Thinning	350
10.3.4	Details of Flashgate Theory	352
10.3.5	Thinning Technology and Backside Performance	357
10.3.6	Alternative Approaches for High QE	358
10.4	Charge Collection Efficiency	360
10.5	Charge Transfer Efficiency	366
10.6	Read Noise	369
10.7	Summary	373
	Acknowledgments	374
	References	374
Chapter 11	Sensors for the Automotive Industry	377
11.1	Introduction	384
11.2	Sensing Technology in Vehicle Systems	384
11.2.1	Manifold Absolute Pressure	386
11.2.2	Tire Pressure Sensor	390
11.2.3	Position, Rotation, and Speed Sensing	391
11.2.4	Flow	399
11.2.5	Accelerometers	401
11.3	Future Automotive Sensing	407
11.3.1	High-Temperature Operation	407
11.3.2	Liquid Level	407
11.3.3	Chemical Sensing	408
11.3.4	Oil Quality	410
11.3.5	Capability to Compute Rather than Sense	410
11.3.6	Vehicle Diagnostics	412
11.3.7	RF Sensor Applications	413
11.3.8	Future Sensor Requirements	414
11.4	Summary	417
	References	418
Chapter 12	Signal Processing for Micromachined Sensors
12.1	Introduction	421
12.2	Sensing Methods	421
12.2.1	Piezoelectric Sensing	422
12.2.2	Piezoresistive Sensing	424
12.2.3	Capacitive Sensing	428
12.3	Open- and Closed-Loop Systems	433
12.3.1	Different Micromachined Structures--Mechanical Issues	433
12.3.2	Open-Loop Capacitive Sensing	438
12.3.3	Closed-Loop Capacitive Sensing	440
12.4	Integration	446
12.4.1	Integrated Pressure Sensor	446
12.4.2	Integrated Accelerometer	446
12.4.3	Dynamic Considerations	448
12.4.4	Shock Considerations	450
12.4.5	Self-Test Features	452
12.4.6	Testing and Trimming	453
12.5	Summary	455
	References	455
Chapter 13	Controlled Oscillators and Their Applicability to Sensors
13.1	Introduction	457
13.2	Controlled Sinusoidal Oscillators	458
13.2.1	The Oscillator Circuit and Its Control Characteristics	458
13.2.2	Oscillator Amplitude and Frequency Transients	461
13.2.3	Interaction of the Frequency and Amplitude Controls	463
13.2.4	Sinusoidal Oscillators in Applications	466
13.3	Controlled Multivibrators	467
13.3.1	Multivibrators versus Sinusoidal Oscillators	467
13.3.2	Multivibrators with Operational Amplifiers	468
13.3.3	Switches in the Basic Multivibrator Circuits	471
13.3.4	One-Amplifier Multivibrator	476
13.3.5	Voltage-to-Frequency Converters	479
13.3.6	Current-to-Frequency Converters	484
13.3.7	Duty-Cycle Modulation	504
13.3.8	Controlled Multivibrators in Applications	507
13.4	Summary	507
	References	508
	About the Authors	511
	Index	517

Editorial Reviews

...A results-oriented book...Quality line drawings, lucid photography, and informative graphs are used generously in support of the text...The theoretical rigor of each chapter amply supports the real-world design examples that follow. Many chapters include practical solutions to problems that are commonly encountered in designing the device being discussed...the volume's excellent graphics and text demystify many basic — but complex — concepts...

Sensors Magazine

A comprehensive, unified text on sensor technology and devices, for practicing engineers, scientists, and advanced graduate students. The topics are arranged in logical order in the form of five sections. Besides the introduction to a sensor world, four other important areas are covered: modeling, sensor technology, devices and applications, and specific circuits for sensors. Each chapter is self-contained for the benefit of readers interested in a particular subject. Annotation c. Book News, Inc., Portland, OR (booknews.com)

Booknews