Failure-Free Integrated Circuit Packages: Systematic Elimination of Failures / Edition 1

by Charles A. Harper, Charles Cohn

Overview

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SPOT, STOP, AND ANALYZE IC DEVICE FAILURE WITH THIS UNIQUE ILLUSTRATED GUIDE

Worth more than a thousand words, each illustration in Failure- Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques.

Failure-Free Integrated Circuit Packages helps you:

* Find, identify, and correct potential failures before they occur
* Improve device reliability
* Learn from case studies of IC package failure modes
* Quickly locate failures through visual comparisons
* Apply state-of-the-art failure analysis techniques
* Comprehend the physics behind the failure mechanism
* Understand the limitations of reliability testing and lifetime estimation

INSIDE, YOU’LL FIND A PRACTICAL AND EASY WAY TO APPROACH FAILURE ANALYSIS OF ICs IN ORGANIC PACKAGES. AREAS COVERED INCLUDE:
Fundamentals of IC package technologies
Reliability
Physics and chemistry of failures in packaged devices
Strategies for locating failures
Failure analysis techniques
Failure modes common in organic IC packages
Emerging assembly materials for IC packaging

Product Details

ISBN-13:	9780071434843
Publisher:	McGraw Hill LLC
Publication date:	07/27/2004
Series:	Professional Engineering Ser.
Pages:	366
Product dimensions:	6.20(w) x 9.10(h) x 1.30(d)

About the Author

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.

Charles Cohn is a Distinguished Member of Technical Staff in the IC Packaging and Interconnection Organization at Agere Systems. He has been with AT&T /Lucent/Agere for 21 years, and is currently lead technologist for Agere’s operations in this field. He has conducts many seminars in advanced IC packaging and interconnection, the U.S. and overseas, and has been awarded ten US patents

Table of Contents

	Foreword	vii
	Preface	xi
	About the Contributors	xiii
Chapter 1	Introduction	1
1.1	Overview	1
1.2	More about the IC Package	5
1.3	Multiple Technologies/Multiple Failure Mechanisms	8
1.4	References	16
Chapter 2	Fundamentals of IC Package Technologies	17
2.1	The IC Package	17
2.2	Package Families	19
2.2.1	Through-Hole Mounted Packages	20
2.2.2	Surface Mounted Packages	23
2.3	Package Technologies	26
2.3.1	Molded Plastic Technology	27
2.3.2	Pressed Ceramic (Glass-Sealed Refractory) Technology	30
2.3.3	Cofired Laminated Ceramic Technology	32
2.3.4	Laminated Plastic Technology	39
2.4	Comparison of Package Technologies	56
2.5	Summary and Future Trends	58
2.6	References	62
Chapter 3	Device Reliability	65
3.1	What is Reliability?	65
3.2	Accelerated Aging	67
3.3	Failure Mode and Effects Analysis	69
3.4	The Kinetics of Degradation	70
3.5	Hazard Rates	80
3.6	Common Mathematical Functions Used for Estimating Reliability	82
3.7	Cost of Reliability	84
3.8	References	85
Chapter 4	Physics and Chemistry of Failures in Packaged Devices	87
4.1	Introduction	87
4.2	Mass Transport Effects	88
4.2.1	Solid-State Reactions	88
4.2.2	Liquid-State Reactions	96
4.2.3	Electromigration	100
4.3	Thermal Mismatch Effects	102
4.4	Humidity Effects	111
4.5	References	113
Chapter 5	Strategies for Locating Failures	115
5.1	Interpreting Electrical Test Results	115
5.2	Using Package Design Files as Failure Roadmaps	116
5.2.1	Introduction to Package Design File Structures	117
5.2.2	Wirebond Diagrams	117
5.2.3	Flip Chip Bump Maps	119
5.2.4	Package Design Files	120
5.2.5	Package Net Lists	123
5.3	Automated Test Equipment Failure Error Logs: Starting with the Failure Data	124
5.4	Test Vehicle Design with Improved Fault Isolation Capabilities	125
5.4.1	Issues with Fault Isolation Using Production Packaged Devices	127
5.4.2	Cost of Doing Package Evaluations on Production Devices	127
5.4.3	Benefits of Simplified Opens and Shorts Testing for Quick Evaluation of New Packaging	127
5.4.4	Generating Opens and Shorts Testers in Production Devices	128
5.4.5	Single-Metal-Level Silicon Die as Drop in Opens and Shorts Testers	128
5.5	Case Study No. 1: Finite Element Analysis to Help Identify Root Causes	130
5.5.1	Package Information	131
5.5.2	FEA Modeling Considerations	133
5.5.3	Simulation Results	136
5.5.4	Discussion	137
5.6	Case Study No. 2: Large Die Flip Chip Test Vehicle	141
5.6.1	Test Vehicle Description	142
5.6.2	Reliability Testing Program	146
5.6.3	Design of Experiment Descriptions	149
5.6.4	Failure Analysis Approach	150
5.6.5	Finite Element Analysis Approach	150
5.6.6	Results and Discussion	151
5.6.7	Concluding Remarks	166
5.7	Case Study No. 3: Multichip Plastic BGA	168
5.7.1	Device Description	169
5.7.2	Reliability Test Program	171
5.7.3	Finite Element Analysis	180
5.7.4	Design Of Experiment	184
5.7.5	Concluding Remarks	185
5.8	Conclusion	185
5.9	References	186
Chapter 6	Failure Analysis Techniques	187
6.1	Imaging Techniques	187
6.1.1	Optical Microscopy	188
6.1.2	Real-Time X-Ray Analysis	189
6.1.3	Scanning Acoustic Microscopy	191
6.1.4	Thermal Imaging	197
6.1.5	Scanning Electron Microscopy	201
6.1.6	Transmission Electron Microscopy	204
6.1.7	Focused Ion Beam	208
6.1.8	Moire Interferometry	211
6.1.9	Shadow Moire	213
6.1.10	Scanning Superconducting Quantum Interference Device Microscopy	215
6.1.11	Dye Penetrant Leak Detection	218
6.2	Analytical Techniques	222
6.2.1	Energy Dispersive Spectroscopy	223
6.2.2	Auger Electron Spectroscopy	227
6.2.3	X-Ray Photoelectron Spectroscopy	229
6.2.4	Fourier Transform Infrared Spectroscopy	230
6.2.5	Wetting Balance Solderability Test	233
6.3	Electrical Techniques	234
6.3.1	DC Electrical Characterization	234
6.3.2	Time Domain Reflectometry	236
6.4	Destructive Techniques	240
6.4.1	Package Decapsulation Techniques	240
6.4.2	Mechanical Polish Techniques	243
6.4.3	Dry Etching for Package FA	248
6.4.4	Wirebond Pull and Shear	251
6.5	References	254
Chapter 7	Examples of Failure Modes Common in Organic IC Packages	257
7.1	Introduction	257
7.2	Failures in Dual In-Line Packages	258
7.2.1	Open Contacts--Lifted Ball Bonds	258
7.3	Failures in Quad Flat Packs	259
7.3.1	Open Contacts--Sheared Ball Bonds	259
7.3.2	Open Contacts--Sheared Ball Bonds	262
7.3.3	Opens and Shorts--Intermetallic Growth	263
7.3.4	Shorted Leads--Foreign Material between Leads	264
7.3.5	Shorted Leads--Foreign Material between Leads	266
7.4	Failures in Plastic Ball Grid Array Packages	269
7.4.1	Open Contact--Via Barrel Cracking	269
7.4.2	Open Contacts--Cracked Signal Traces in Substrate	272
7.4.3	Open Contacts--Via Knee Cracking	272
7.4.4	Open Contacts--Lifted Wedge Bonds	277
7.4.5	Open Contact--Cracked Via Barrel	281
7.4.6	Open Contact--Cracked Signal Trace in Substrate	282
7.4.7	Open Contact--Lifted Ball Bonds	283
7.4.8	Open Contact--Broken Bond Wire	286
7.4.9	Open Contact--Cracked Die	287
7.4.10	Shorted Contacts--Die Attach Material on Exposed Cu	288
7.5	Failures in Matrix Ball Grid Array Packages	292
7.5.1	Open Contact--Via Knee Cracking	292
7.5.2	Substrate Opens--Cracked Signal Trace in Substrate	293
7.6	Failures in Plastic BGA Multichip Modules	295
7.6.1	Intermittent Open Contacts--Cracked Signal Traces	295
7.6.2	Open Contacts--Cracked Signal Traces	296
7.6.3	Functional--Dendritic Growth	298
7.6.4	Shorted Contacts--Die Attach Material on Exposed Cu	302
7.7	Failures in Plastic Enhanced Ball Grid Array, Cavity-Down Packages	302
7.7.1	Open Contacts--Broken Bond Wires	302
7.7.2	Open Contacts--Sheared Ball Bonds/Damaged Signal Traces	305
7.8	Failures in Plastic Flip Chip Ball Grid Array Packages	305
7.8.1	Open Contacts--Cracks around FC Bump Pads	305
7.8.2	Open Contacts--Cracks around BGA Pads	309
7.8.3	Open Contacts--Flip Chip Bump Cracking	315
7.8.4	Open Contact--Incomplete Via Shape	317
7.8.5	Shorted Contacts--Vertical Deformation of Signal Trace	319
7.8.6	Shorted Contact--In-Plane Cu Bridge	321
Chapter 8	Emerging Assembly Materials for IC Packaging	325
8.1	Introduction	325
8.2	Lead-Free-Compatible Assembly Materials	326
8.2.1	Characteristics Specific to Lead-Free Materials	326
8.2.2	Lead-Free-Compatible Mold Compounds	329
8.2.3	Lead-Free-Compatible Die Attach	348
8.3	Concluding Remarks	352
8.4	References	353
	Index	355

Editorial Reviews

Failure-Free Integrated Circuit Packages is a new book in Charles Harper's Electronic Packaging and Interconnection Series. The subtitle explains further what this book is focusing on, namely the systematic elimination of failures through reliability engineering, failure analysis, and material improvements. The publication makes ample us of illustrations and has the depth and breadth to become a useful quality guide for manufacturers and users of integrated circuit packages.

The co-editors Charles Cohn (Agere Systems) and Charles Harper (Technology Seminars, Inc.) have assembled a knowledgeable group of authors, all employees of Agere Systems, many of them bringing a wealth of insight based on their experience with AT&T and Lucent Technologies, the grandparents and parents of Agere Systems. While some might be critical of this book in that it reflects the practices of only one company, the fact is that the book comes from the organization that literately "wrote the books" on quality and reliability that established the high standards in the electronic industry that we have today. The authors of the chapters in this edited book have in-depth, long experience in their individual subjects creating an excellent reference book.

Reliability of advanced IC packages is a hot topic more so than ever. The use of brittle low Dk dielectric in the redistribution layers of the IC makes these chips more prone to cracking than ICs with all SiO2 dielectric layers. Better CTE (coefficient of thermal expansion) match of all package layers to the low CTE of the IC becomes important, as does the use of buffer or compliant layers. The very fine pitch and tight via spacing on build-up dielectric microvia layers makes these packages more susceptible to CAF (conductive anodic filament) formation. Furthermore, no-lead solders require higher reflow temperatures and thermal management has become critical as thermal densities of ICs approach 100 W/cm2.

The book is structured into eight chapters: an introduction and overview, fundamentals of IC package technologies, reliability, physics and chemistry of failures in packaged devices, strategies for locating failures, failure analysis techniques, failure modes common in organic IC packages, and emerging assembly materials for IC packaging. The chapters on strategies for locating failures, failure analysis techniques, and examples of failure modes common in organic IC packages make up the bulk of the book. The Strategies for Locating Failures chapter contains three useful case studies that employ finite element modeling and design of experiments to probe root causes of failures.

The Melissa E. Grupen-Shemansky's Introduction provides a good overview and "roadmap" to the chapters in the book. It provides important background for the reader to understand the changes in the industry structure and the issues in insuring a high level of quality and reliability in what has become a complex supply chain.

Charles Cohn's chapter on the "Fundamentals of IC Package Technologies" is well done and, while there are some minor historical inaccuracies, provides excellent background on mature as well as emerging technologies useful to both the novice and those experienced in the field. Charles does not assume that the reader is familiar with the alphabet soup of package names, and he carefully explains acronyms when they first appear. The author has subdivided the technologies into four generic types comparing attributes and tradeoffs, physical properties and rankings. ... the chapter is a very good overall summary of packaging technology.

Jason P. Goodelle's and John W. Osenbach's chapter on Emerging Assembly Materials for IC Packaging give useful insight in the relationship between chemical structures and chemical and mechanical properties of materials as they impact package reliability. ...

The failure analysis chapters are profusely illustrated with charts, graphs and photographs for easy understanding of defects and failure modes. A very effective case study approach is used to lead one through the various steps from problem recognition to fault location to cause and solution. Guideline charts and protocols or strategies for analysis are detailed. The examples of test vehicles for reliability testing and case study examples are most useful for they address issues with large I/O new and advanced package types. ... This book is one that should be a primary reference for anyone involved in IC packaging, Reliability or Quality engineering.

CircuiTree Magazine

Integrated circuit packages are unquestionably the heart of modern electronic assemblies. With the ever-increasing functional density and complexity of these advanced electronic packages, the need to find, identify, and correct potential failures before they occur becomes more and more critical. And the multiple locations, even

internationally, required for the complete cycle of design, manufacture, and use of these packages often further complicate the problems of achieving failure-free integrated circuit assemblies. Hence, since integrated circuit packages are so widely used, in their various forms, this just-released new book will be invaluable for the book shelves of most readers of this review.

Entirely written by the staff of experienced specialists at Agere Systems (formerly Lucent and AT&T), this book is loaded with practical, real world, illustrations and examples. It could, in fact, well serve as an in-plant guidebook for quality control, failure analysis, and accept-reject criterion. The book is divided into eight well-organized and clearly presented chapters, including descriptions of the various IC packaging technologies, understanding of all of the device reliability factors, physics and chemistry of failures in packaged devices, strategies for locating failures, all of the many failure analysis techniques, clear presentations of all of the many common failure modes, a wide range of examples and case histories, and excellent discussions of the new IC packaging materials, including lead-free solders.

This book should be invaluable for most book shelves, and also as an in-plant guidebook for quality and reliability operations.

IMAPS (International Microelectronics and Packaging Society) Electronic Bulletin

...easy to tell that this is one of the most useful books in the field of IC packaging reliability to come along in some time....If the IDMs and packaging foundries would pass this book out to new engineering hires, it might prevent some of those arduous, litigation-infested dramas that occur as customer and buyer try to plant the blame on each other for packaged ICs that fail in the field, seemingly without reason.

...there is a lot of solid meat-and-potatoes content and very little puffery....topics are fairly all-encompassing and include by chapter title, "Fundamentals of IC Package Technolgoy," "Device Reliability" and "Physics and Chemistry of Failures in Packaged Devices." Chapter 5, "Strategies for Locating Failures" by itself would be worth the modest price of admission.

Chip Scale Review