Title: 5G for Future Wireless Networks: Second EAI International Conference, 5GWN 2019, Changsha, China, February 23-24, 2019, Proceedings, Author: Victor C. M. Leung
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Title: 5G Networks: Fundamental Requirements, Enabling Technologies, and Operations Management / Edition 1, Author: Anwer Al-Dulaimi
Title: 5G Networks: Planning, Design and Optimization, Author: Christofer Larsson BSc
Title: 5G New Radio: A Beam-based Air Interface / Edition 1, Author: Mihai Enescu
Title: 5G NR: Architecture, Technology, Implementation, and Operation of 3GPP New Radio Standards, Author: Sassan Ahmadi
Title: 5G Physical Layer Technologies / Edition 1, Author: Mosa Ali Abu-Rgheff
Title: 5G Spectrum and Standards / Edition 2, Author: Geoff Varrall
Title: 5G System Design: Architectural and Functional Considerations and Long Term Research / Edition 1, Author: Patrick Marsch
Title: 5G Verticals: Customizing Applications, Technologies and Deployment Techniques / Edition 1, Author: Rath Vannithamby
Title: 5G-Enabled Vehicular Communications and Networking, Author: Xiang Cheng
Title: 5th International Symposium of Space Optical Instruments and Applications: Beijing, China, September 5-7, 2018, Author: H. Paul Urbach
Title: 64 to 256-Megabit Reticle Generation: Technology Requirements and Approaches, Author: Gregory K. Hearn
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Title: 74th Conference on Glass Problems, Volume 35, Issue 1 / Edition 1, Author: S. K. Sundaram
Title: 75th Conference on Glass Problems: A Collection of Papers Presented at the 75th Conference on Glass Problems, Greater Columbus Convention Center, Columbus, Ohio, November 3-6, 2014, Volume 36, Issue 1 / Edition 1, Author: S. K. Sundaram
Title: 76th Conference on Glass Problems, Version A: A Collection of Papers Presented at the 76th Conference on Glass Problems, Greater Columbus Convention Center, Columbus, Ohio, November 2-5, 2015, Volume 37, Issue 1 / Edition 1, Author: S. K. Sundaram
Title: 77th Conference on Glass Problems: A Collection of Papers Presented at the 77th Conference on Glass Problems, Greater Columbus Convention Center, Columbus, OH, November 7-9, 2016, Volume 38, Issue 1 / Edition 1, Author: S. K. Sundaram
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