Title: The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages / Edition 1, Author: Gerard Kelly
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
Title: Thermal Guidelines for Data Processing Environments, 2nd Edition / Edition 2, Author: ASHRAE
Title: Thermal Measurements in Electronics Cooling / Edition 1, Author: Kaveh Azar
Title: Three-Dimensional Television, Video, and Display Technologies / Edition 1, Author: Bahram Javidi
Title: Troubleshooting and Repairing Major Appliances, Author: Eric Kleinert
Title: Troubleshooting and Repairing Major Appliances / Edition 3, Author: Eric Kleinert
Title: Vibration Analysis for Electronic Equipment / Edition 3, Author: Dave S. Steinberg

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