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Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
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Handbook Of Tape Automated…
by John H. Lau
Hardcover $219.99
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
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Chip On Board: Technology for…
by John H. Lau
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Hardcover $219.99
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
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Air Cooling Technology for…
by Sung Jin Kim, Sang Woo Lee
Hardcover $77.99
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies / Edition 1, Author: Karl J. Puttlitz
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Handbook of Lead-Free Solder…
by Karl J. Puttlitz, Kathleen A. Stalter
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Hardcover $500.00
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
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LED Packaging for Lighting…
by Shen Liu, Xiaobing Luo
Hardcover $179.95
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability / Edition 1, Author: Michael Pecht
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Integrated Circuit, Hybrid,…
by Michael Pecht
Hardcover $212.95
Title: Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications / Edition 2, Author: James J. Licari
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Handbook of Polymer Coatings…
by James J. Licari, Laura A. Hughes
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Hardcover $155.00
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Paperback $279.99
Title: Laser Diode Chip and Packaging Technology, Author: Pei C. Chen
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Laser Diode Chip and Packaging…
by Pei C. Chen, Tomas D. Milster
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Paperback $66.00
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael G. Pecht, Edward B. Hakim
Paperback $54.95
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht
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Quality Conformance and…
by Michael Pecht, Abhijit Dasgupta, John W. Evans, Jillian Y. Evans
Paperback $188.95
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
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High Temperature Electronics /…
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
Paperback $82.99
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
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Hardcover $329.99
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
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Electronic Packaging and…
by Charles A. Harper
Hardcover $250.00
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
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Materials for Electronic…
by Deborah D.L. Chung
Hardcover $300.00
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
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The Basics of Soldering /…
by Armin Rahn
Hardcover $312.95
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
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Mechanical Analysis of…
by Mckeown
Paperback $82.99
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
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Electronic Equipment Packaging…
by Gerald L. Ginsberg
Hardcover $109.99
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
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Thermal Design of Electronic…
by Ralph Remsburg
#10 in Series
Hardcover $230.00
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
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Microscale Heat Transfer -…
by S. Kakaï, L.L. Vasiliev, Y. Bayazitoglu, Y. Yener
#193 in Series
Paperback $329.99

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