Industrial Applications of Adhesives: 1st International Conference on Industrial Applications of Adhesives

by Lucas F. M. da Silva (Editor), Robert D. Adams (Editor), Chiaki Sato (Editor), Klaus Dilger (Editor)

Overview

This book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). It covers a wide range of topics, including adhesive curing for electronic and automotive industries; adhesive testing with a torsion machine for rigorous mechanical properties determination; joint design using innovative techniques such as the meshless method; design methodologies in the automotive industry for joints under impact; temperature effects in joints typically found in civil engineering; and advanced nondestructive techniques such as terahertz spectroscopy to assess the durability of adhesive joints. Providing a review of the state-of the art in industrial applications of adhesives, the book serves as a valuable reference resource for researchers and graduate students interested in adhesive bonding.

Product Details

ISBN-13:	9789811567698
Publisher:	Springer Nature Singapore
Publication date:	07/22/2020
Series:	Lecture Notes in Mechanical Engineering
Edition description:	1st ed. 2021
Pages:	138
Product dimensions:	6.10(w) x 9.25(h) x (d)

Table of Contents

Novel torsion machine to test adhesive joints.- Ageing condition determination of bonded joints by terahertz spectroscopy.- Analysis of Temperature Effect on Deformation Behaviour and Bond Strength of Adhesive Joints with Steel and Composite Substrates.- Some Industrial Examples of Accelerated Curing Using Curie Particles.- Use of UV-curing adhesive systems on non-transparent joining parts by using sidelight activated polymer optical fibres.- Techniques for the mechanical characterization and numerical modelling of bonded automotive structures under impact loads.