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Computer Integrated Electronics Manufacturing and Testing
560
Computer Integrated Electronics Manufacturing and Testing
560eBook
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Overview
Describes this process at it relates to the electronics industry, focusing on such areas as printed wiring boards, networking, automatic assembly, surface mount technology, tape automated bonding, bar coding, and electro-static discharge. Also studies the effects of group work ethics as a factor in
About the Author
Jack Arabian is Manager of Process Technology Assessment at Digital Equipment Corporation in Andover, Massachusetts. Previously he has worked as an electronics designer, systems designer, manufacturing engineer, and test engineer at such corporations as Westinghouse, MIT Instrumentation Laboratories (now called C.S. Draper Labs), Polaroid, Northrop, and Foxboro. Mr. Arabian has written many papers for test and design conferences in the U.S. and abroad, has received awards from the Institute of Electrical and Electronics Engineers (IEEE) and the British Society of Test Engineers, of which he is a member, and is an editorial board member of the Journal of Electronics Testing: Theory and Applications and Design and Test of Computers. Among the numerous professional societies he belongs to are the Institute of Quality Assurance and IEEE. Mr. Arabian received the A.B. degree (1951) in engineering sciences and applied physics from Harvard University, Cambridge, Massachusetts, and M.S. degree (1970) in aeronautical and astronautical sciences from the Massachusetts Institute of Technology, Cambridge.
Table of Contents
Contents -- PREFACE -- ACKNOWLEDGMENTS -- INTRODUCTION -- CHAPTER-1 THE PRINTED WIRING BOARD (PWB) IN ELECTRONICS MANUFACTURING -- 1.1 INTRODUCTION -- 1.2 HISTORICAL PERSPECTIVE ON PRINTED WIRING BOARDS -- 1.3 DESIGN OF THE PRINTED WIRING BOARD FOR MANUFACTURING -- 1.4 SUBSTRATE MATERIALS FOR PRINTED WIRING BOARDS -- 1.5 PRINTED WIRING BOARD CONSTRUCTION FOR MANUFACTURING -- 1.6 ADVANCED PRINTED WIRING BOARD TECHNIQUES -- CHAPTER-2 SOLDER AND AUTOMATED SOLDERING PROCESSES -- 2.1 INTRODUCTION -- 2.2 AUTOMATED SOLDERING PROCESSES -- 2.3 SOLDER FLUXES -- 2.4 SOLDER PLATING PROCESSES -- 2.5 WAVE SOLDERING -- 2.6 SOLDER PASTE MATERIALS -- 2.7 SOLDER QUALITY -- 2.8 SOLDER AND MATERIALS STORAGE PRECAUTIONS -- 2.9 SOLDER PASTE AND ITS APPLICATION -- 2.10 SCREEN PRINTING -- 2.11 SOLDER REFLOW PROCESSES -- 2.12 SOLDER PROCESS YIELD -- 2.13 SOLDER TEST PROCEDURES -- 2.14 COST CONSIDERATIONS IN SOLDERING -- 2.15 DEFINITIONS FOR SOLDER PROCESSES -- 2.16 LIST OF VENDORS FOR SOLDER PROCESSES -- CHAPTER-3 AUTOMATED ASSEMBLY TECHNIQUES -- 3.1 INTRODUCTION -- 3.2 HISTORICAL PERSPECTIVE ON AUTOMATED ASSEMBLY -- 3.3 METRICS ANALYSIS -- 3.4 DESIGN FOR MANUFACTURABILITY AND TESTABILITY (DFM /T) -- 3.5 DESIGN FOR ASSEMBLY (DFA) -- 3.6 AUTOMATED ASSEMBLY MACHINES, GENERAL -- 3.7 COMPUTER-AIDED MANUFACTURING (CAM) -- 3.8 COMPUTER-INTEGRATED MANUFACTURING (CIM) -- 3.9 VIBRATORY BOWL FEEDERS -- 3.10 SCREWDRIVING AND RIVETING FEEDER RATES -- 3.11 TAPE-SEQUENCING MACHINE -- 3.12 AUTOMATIC INSERTION -- 3.13 ADHESIVE AND SEALANT DISPENSING -- 3.14 WELDING APPLICATIONS -- 3.15 ASSEMBLY PROCESS YIELDS -- CHAPTER-4 ESD (ELECTROSTATIC DISCHARGE) -- 4.1 OVERVIEW -- 4.2 THE TRIBOELECTRIC EFFECT -- 4.3 SAFETY CONSIDERATIONS IN GROUNDING SURFACES -- 4.4 THE COMPLETE WORKSTATION PROTECTED AGAINST ESD -- 4.5 PRODUCTION LINE TECHNIQUES TO PREVENT ESD -- 4.6 ELECTRICAL INDUCTION AND ESD IN MANUFACTURING -- 4.7 MEASUREMENT AND TEST TECHNIQUES -- 4.8 IONIZATION -- 4.9 CONTAMINATION -- 4.10 THE MECHANISM OF DAMAGE BY ESD -- 4.11 DESIGN CONSIDERATIONS IN PREVENTION OF ESD -- CHAPTER-5 BAR CODING AND OTHER MARKING SYSTEMS -- 5.1 INTRODUCTION -- 5.2 ELEMENTARY DESCRIPTION OF BAR CODES -- 5.3 BAR CODES IN MANUFACTURING AND TEST -- 5.4 SYSTEM CONSIDERATIONS FOR BAR CODING -- 5.5 SOFTWARE CONSIDERATIONS FOR BAR CODE SYSTEMS -- 5.6 MACHINE READABILITY AND LABELS -- 5.7 PRODUCTIVITY AND PRODUCTIVITY INCREASES USING BAR CODES -- 5.8 BAR CODE READING PARAMETERS -- 5.9 BAR CODE PRINTING -- 5.10 OPTICAL CHARACTER READING OR RECOGNITION (OCR) -- 5.11 MAGNETIC STRIPE TECHNOLOGY -- 5.12 RADIO FREQUENCY IDENTIFICATION (RFID) -- 5.13 HISTORIC MILESTONES IN BAR CODING -- 5.14 BAR CODE SCANNING EQUIPMENT -- 5.15 BAR CODING CASE HISTORIES -- 5.16 FUTURE APPLICATIONS OF BAR CODING -- 5.17 BAR CODE DESIGN -- CHAPTER-6 MANUFACTURING TEST -- 6.1 OVERVIEW -- 6.2 BASIC ELECTRICAL TESTING -- 6.3 PROCESS TESTING -- 6.4 HIGH DENSITY CIRCUIT TESTING -- 6.5 CONTACT VS. NONCONTACT TESTING -- 6.6 AUTOMATIC TEST EQUIPMENT (ATE) -- 6.7 TESTABILITY AND TEST ENGINEERING RESPONSIBILITIES -- 6.8 MANUFACTURING TEST STRATEGY OVERVIEW -- 6.9 TESTS AND TEST EQUIPMENT -- 6.10 DETAILED TEST STRATEGY -- 6.11 SPECIAL FORMS OF CIRCUIT PROBING -- 6.12 AUTOMATED BOARD HANDLING -- 6.13 BUILT-IN SELF TEST (BIST) -- 6.14 FORMS OF SELF TEST -- 6.15 AN EXAMPLE OF INTERNAL DIAGNOSTICS -- 6.16 AUTOMATED OPTICAL INSPECTION (AOI) SYSTEMS -- 6.17 OHMEGA LAYER TESTING -- 6.18 LIST OF BARE BOARD TEST VENDORS -- CHAPTER-7 COMPUTER-ASSISTED REPAIR -- 7.1 INTRODUCTION -- 7.2 MONITORING THE PASS-REJECT STATUS OF PARTS -- 7.3 CAR AND CIM -- 7.4 DIAGNOSIS AND REPAIR -- 7.5 COMMERCIAL CAR-RELATED SYSTEMS -- CHAPTER-8 NETWORKING FOR ELECTRONICS MANUFACTURING -- 8.1 INTRODUCTION -- 8.2 NETWORKING FOR MANUFACTURING -- 8.3 THE SYNERGY BETWEEN DfSIGN AND MANUFACTURING -- 8.4 NETWORK CONFIGURATIONS -- 8.5 NETWORK TRANSMISSION CONFIGURATIONS -- 8.6 NETWORKING STANDARDS AND PROTOCOLS -- 8.7 SYSTEM NETWORKING COSTS -- CHAPTER-9 SURFACE MOUNT TECHNOLOGY (SMT) AND TAPE AUTOMATED BONDING (TAB) -- 9.1 INTRODUCTION -- 9.2 SURFACE MOUNT INTERCONNECT -- 9.3 LEAD STRESS IN SMT -- 9.4 OPTICAL PATTERN REFERENCES: FIDUCIALS -- 9.5 DEVICE PLACEMENT (PICK-AND-PLACE) MACHINES -- 9.6 TEST CONSIDERATIONS FOR SMT -- 9.7 CLEANING OF SMT PWBS -- 9.8 SMT YIELD -- 9.9 TAPE AUTOMATED BONDING (TAB) INTERCONNECT -- 9.10 NOMENCLATURE AND TECHNIQUES UNIQUE TO TAB -- 9.11 BONDING PROCESSES FOR TAB -- 9.12 TEST CONSIDERATIONS FOR TAB -- 9.13 ENCAPSULATION FOR TAB -- 9.14 STANDARDS FOR TAB -- CHAPTER-10 ARTIFICIAL INTELLIGENCE AND EXPERT SYSTEMS IN MANUFACTURING -- 10.1 INTRODUCTION -- 10.2 DOMAINS OF ARTIFICIAL INTELLIGENCE -- 10.3 AI APPLICATIONS IN MANUFACTURING -- 10.4 SUMMARY -- CHAPTER-11 KAISHA AND ELECTRONICS MANUFACTURING -- 11.1 INTRODUCTION -- 11.2 KAISHA COMPETITIVE STRATEGY -- 11.3 JUST IN TIME (JIT) MANUFACTURING -- 11.4 KAISHA FINANCIAL STRUCTURE -- 11.5 SUMMARY -- CHAPTER-12 WAVES OF OPPORTUNITY -- 12.1 INTRODUCTION -- 12.2 WAVES OF OPPORTUNITY -- 12.3 DECLINING INDUSTRIES -- 12.4 FLEXIBILITY IS AN ASSET -- 12.5 TECHNOLOGY TRANSFER -- 12.6 SUMMARY -- APPENDIX A CONTAMINATION PROBLEMS OF PWBS DURING MANUFACTURING AND TEST -- APPENDIX B INTERMETALLIC FORMATION IN SOLDER PROCESSING -- APPENDIX C BACKGROUND ON SCREEN PRINTING: THICK-FILM CIRCUITS -- APPENDIX D LIST OF ABBREVIATIONS -- APPENDIX E LIST OF DEFINITIONS -- INDEX.From the B&N Reads Blog
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