CAE - CAD and Thermal Management Issues in Electronic Systems: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997

by Dereje Agonafer (Editor)

Overview

Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas. Collection of 12 full-length, peer-reviewed technical papers. Contents includes "Use of Aluminum Foam as a Heat Sink for Power Electronic Devices," "Experimental Study of Automatic Brake System Temperatures," "Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 1, Study of Contact Area; Part 2, Study of Thermal Contact Resistance," etc. By: Dereje Agonafer, Cristina H. Amon, Christian Belady, Greg Kowalski and Alfonso Ortega

Product Details

ISBN-13:	9780791818527
Publisher:	American Society of Mechanical Engineers
Publication date:	01/29/1997
Series:	Eep - HTD Series
Pages:	116
Product dimensions:	6.00(w) x 1.25(h) x 9.00(d)

Editorial Reviews

Proceedings of the November 1997 symposium. Twelve papers relate to the use of computer simulations to solve complex packaging problems related to thermo/mechanical problems. Topics include improving electronic packaging manufacturing through product and process-driven analysis; thermo-mechanical analysis of solder-sealed electronic modules during power cycling; experimental study of automotive brake systems; the recommended geometry for laminar microchannel heat sinks; transient thermal analysis of outdoor electronic equipment; and contact area and thermal contact resistance in an ideal bolted joint. No index. Annotation c. by Book News, Inc., Portland, Or.

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