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Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
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LED Packaging for Lighting…
by Shen Liu, Xiaobing Luo
Hardcover $179.95
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
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Hermeticity of Electronic…
by Hal Greenhouse
Hardcover $199.00
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability / Edition 1, Author: Michael Pecht
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Integrated Circuit, Hybrid,…
by Michael Pecht
Hardcover $212.95
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
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The Handbook of Machine…
by Ralph W. Woodgate
Explore Series
Hardcover $218.95
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
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Materials for Electronic…
by Deborah D.L. Chung
Hardcover $300.00
Title: Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications / Edition 2, Author: James J. Licari
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Handbook of Polymer Coatings…
by James J. Licari, Laura A. Hughes
Explore Series
Hardcover $155.00
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
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The Basics of Soldering /…
by Armin Rahn
Hardcover $312.95
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
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Mechanical Analysis of…
by Mckeown
Paperback $82.99
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht
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Quality Conformance and…
by Michael Pecht, Abhijit Dasgupta, John W. Evans, Jillian Y. Evans
Paperback $188.95
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
Paperback $54.95
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
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Electronic Equipment Packaging…
by Gerald L. Ginsberg
Hardcover $109.99
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
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Adhesives Technology for…
by James J. Licari, Dale W. Swanson
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Paperback $199.00
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Paperback $279.99
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
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Microscale Heat Transfer -…
by S. Kakaï, L.L. Vasiliev, Y. Bayazitoglu, Y. Yener
#193 in Series
Paperback $329.99
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
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Failure Modes and Mechanisms…
by P. Singh, Puligandla Viswanadham
Hardcover $169.99
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
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Package Electrical Modeling,…
by Dean L. Monthei
#2 in Series
Hardcover $109.99
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
Explore Series
Hardcover $329.99
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1, Author: Yong Liu
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Power Electronic Packaging:…
by Yong Liu
Hardcover $279.99
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
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Electronic Packaging Materials…
by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
#4 in Series
Hardcover $200.00
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael G. Pecht, Edward B. Hakim
Paperback $54.95

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