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Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
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Chip On Board: Technology for…
by John H. Lau
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Hardcover $219.99
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
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Microscale Heat Transfer -…
by S. Kakaï, L.L. Vasiliev, Y. Bayazitoglu, Y. Yener
#193 in Series
Hardcover $329.99
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
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The Basics of Soldering /…
by Armin Rahn
Hardcover $312.95
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
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Fundamentals and Essentials of…
by Puligandla Viswanadham
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Hardcover $129.00
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
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Hermeticity of Electronic…
by Hal Greenhouse
Hardcover $199.00
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
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Mechanical Analysis of…
by Mckeown
Paperback $82.99
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
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Materials for Electronic…
by Deborah D.L. Chung
Hardcover $300.00
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht
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Quality Conformance and…
by Michael Pecht, Abhijit Dasgupta, John W. Evans, Jillian Y. Evans
Paperback $188.95
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition / Edition 3, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
Hardcover $200.00
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
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MCM C/Mixed Technologies and…
by W.K. Jones, Karel Kurzweil, Gábor Harsányi, Sylvia Mergui
#2 in Series
Hardcover $219.99
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
Paperback $54.95
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Hardcover $169.99
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
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Adhesives Technology for…
by James J. Licari, Dale W. Swanson
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Paperback $199.00
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
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Manufacturing Challenges in…
by Y.C. Lee, W.T. Chen
Hardcover $109.99
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
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High-Frequency…
by Luc Martens
#1 in Series
Hardcover $109.99
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
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Boundary-Scan Interconnect…
by Josï T. de Sousa, Peter Y.K. Cheung
#18 in Series
Paperback $169.99
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1, Author: Yong Liu
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Power Electronic Packaging:…
by Yong Liu
Hardcover $279.99
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael G. Pecht, Edward B. Hakim
Paperback $54.95
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
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Electronic Packaging and…
by Charles A. Harper
Hardcover $250.00
Title: Advanced Wirebond Interconnection Technology / Edition 1, Author: Shankara K. Prasad
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Advanced Wirebond…
by Shankara K. Prasad
Other Format $329.99

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